Tak proč mám od srpna Windows 10 z ebaye a nebyl jsem na výslechu ? A k tématu to bylo.

si přečti na základě čeho se ty licence přeprodávaj, třeba tenhle prodejce to má hezky popsaný... už si zjistil něco z toho na co sem se ptal?

https://aukro.cz/windows-10-pro-6951672115

"Prodej licencí se děje v souladu se směrnicí Evropského parlamentu a rady 2009/24/ES (čl.4.ods.2) a judikaturou Evropského soudního dvora."

kdo nechce nechat poradit, nenechá si ... žádný command na stabilitu není ... pusť si nějaký zátěžový test, nejlépe náročnější hru a nech na pozadí rozbalený "hwinfo64" , pak screen sem... hned se pozná, co deska zvládá ...

gogo1963 píše:kdo nechce nechat poradit, nenechá si ... žádný command na stabilitu není ... pusť si nějaký zátěžový test, nejlépe náročnější hru a nech na pozadí rozbalený "hwinfo64" , pak screen sem... hned se pozná, co deska zvládá ...

AMD Ryzen 7 2700X ---------------------------------------------------------

[General Information]
Processor Name: AMD Ryzen 7 2700X
Original Processor Frequency: 3200.0 MHz
Original Processor Frequency [MHz]: 3200
CPU ID: 00800F82
Extended CPU ID: 00800F82
CPU Brand Name: AMD Ryzen 7 2700X Eight-Core Processor
CPU Vendor: AuthenticAMD
CPU Stepping: PiR-B2
CPU Code Name: Pinnacle Ridge
CPU Technology: 12 nm
CPU OPN: YD270XBGM88AF
CPU Thermal Design Power (TDP): 105.0 W
CPU Thermal Design Current (TDC): 95.0 A
CPU Electrical Design Current (EDC): 140.0 A
CPU Max. Junction Temperature (Tj,max): 85 °C
CPU Thermal Trip Limit: 115.0 °C
CPU HTC Temperature Limit: 115.5 °C
CPU Type: Production Unit
CPU Platform: AM4
Processor Serial Number: 02151B4B-211E5304
Microcode Update Revision: 8008206
SMU Firmware Revision: 43.20.0
Core Performance Order: 1, 2, 3, 6, 7, 5, 4, 8
Number of CPU Cores: 8
Number of Logical CPUs: 16
[Operating Points]
CPU Minimum: 550.0 MHz = 5.50 x 100.0 MHz
CPU Base: 3200.0 MHz = 32.00 x 100.0 MHz
CPU Boost Max (Fmax): 4350.0 MHz = 43.50 x 100.0 MHz
CPU Current: 3991.8 MHz = 40.00 x 99.8 MHz @ 1.3000 V
CPU Bus Type: UMI
[Cache and TLB]
L1 Cache: Instruction: 8 x 64 KBytes, Data: 8 x 32 KBytes
L2 Cache: Integrated: 8 x 512 KBytes
L3 Cache: 2 x 8 MBytes

[Computer]
Computer Brand Name: Unknown on Noname
[Motherboard]
Motherboard Model: ASUS PRIME B350M-A
Motherboard Chipset: AMD B350 (Promontory)
Motherboard Slots: 4xPCI Express x1, 1xPCI Express x2, 1xPCI Express x4, 1xPCI Express x16
PCI Express Version Supported: v3.0
USB Version Supported: v3.1
[BIOS]
BIOS Manufacturer: American Megatrends
BIOS Date: 08/20/2018
BIOS Version: 4023
AMD AGESA Version: PinnaclePI-AM4 1.0.0.2
UEFI BIOS: Capable
Super-IO/LPC Chip: ITE IT8655E/GX

BIOS Vendor: American Megatrends Inc.
BIOS Version: 4023
BIOS Release Date: 08/20/2018
BIOS Start Segment: F000
BIOS Size: 16 MBytes
System BIOS Version: 5.13
ISA Support: Not Present
MCA Support: Not Present
EISA Support: Not Present
PCI Support: Present
PC Card (PCMCIA) Support: Not Present
Plug-and-Play Support: Not Present
APM Support: Present
Flash BIOS: Present
BIOS Shadow: Present
VL-VESA Support: Not Present
ESCD Support: Not Present
Boot from CD: Present
Selectable Boot: Present
BIOS ROM Socketed: Present
Boot from PC Card: Not Present
EDD Support: Present
NEC PC-98 Support: Not Present
ACPI Support: Present
USB Legacy Support: Present
AGP Support: Not Present
I2O Boot Support: Not Present
LS-120 Boot Support: Not Present
ATAPI ZIP Drive Boot Support: Not Present
IEE1394 Boot Support: Not Present
Smart Battery Support: Not Present
BIOS Boot Specification Support: Present
Function key-initiated Network Service Boot Support: Not Present
Targeted Content Distribution Support: Present
UEFI Specification Support: Present
Virtual Machine: Not Present

Total Width: 64 bits
Data Width: 64 bits
Device Size: 8192 MBytes
Device Form Factor: DIMM
Device Locator: DIMM_B2
Bank Locator: BANK 3
Device Type: DDR4
Device Type Detail: Synchronous
Memory Speed: 2400 MHz
Manufacturer: G-Skill
Serial Number: 00000000
Part Number: F4-3200C14-8GFX

Row: 2 - 8 GB PC4-25600 DDR4 SDRAM G Skill F4-3200C14-8GFX ----------------

[General Module Information]
Module Number: 2
Module Size: 8 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1600.0 MHz (DDR4-3200 / PC4-25600)
Module Manufacturer: G Skill
Module Part Number: F4-3200C14-8GFX
Module Revision: 0.0
Module Serial Number: 0
Module Manufacturing Date: N/A
Module Manufacturing Location: 0
SDRAM Manufacturer: Samsung
DRAM Steppping: 0.0
Error Check/Correction: None
[Module Characteristics]
Row Address Bits: 16
Column Address Bits: 10
Module Density: 8192 Mb
Number Of Ranks: 1
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.83300 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.60000 ns
CAS# Latencies Supported: 9, 11, 13, 15, 16
Minimum CAS# Latency Time (tAAmin): 13.320 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.320 ns
Minimum Row Precharge Time (tRPmin): 13.320 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns
Supported Module Timing at 1200.0 MHz: 16-16-16-39
Supported Module Timing at 1066.7 MHz: 15-15-15-35
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 800.0 MHz: 11-11-11-26
Supported Module Timing at 666.7 MHz: 9-9-9-22
Minimum Active to Active/Refresh Time (tRCmin): 45.375 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 260.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 160.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.299 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): <= 1 mm
Address Mapping from Edge Connector to DRAM: Standard
[Intel Extreme Memory Profile (XMP)]
XMP Revision: 2.0
[Certified Profile [Enabled]]
Module VDD Voltage Level: 1.35 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.62500 ns
CAS# Latencies Supported: 14
Minimum CAS# Latency Time (tAAmin): 8.750 ns
Minimum RAS# to CAS# Delay (tRCDmin): 8.750 ns
Minimum Row Precharge Time (tRPmin): 8.750 ns
Minimum Active to Precharge Time (tRASmin): 21.250 ns
Supported Module Timing at 1600.0 MHz: 14-14-14-34
Minimum Active to Active/Refresh Time (tRCmin): 30.000 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 260.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 160.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 24.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.500 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 5.000 ns

Row: 3 - 8 GB PC4-25600 DDR4 SDRAM G Skill F4-3200C14-8GFX ----------------

[General Module Information]
Module Number: 3
Module Size: 8 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1600.0 MHz (DDR4-3200 / PC4-25600)
Module Manufacturer: G Skill
Module Part Number: F4-3200C14-8GFX
Module Revision: 0.0
Module Serial Number: 0
Module Manufacturing Date: N/A
Module Manufacturing Location: 0
SDRAM Manufacturer: Samsung
DRAM Steppping: 0.0
Error Check/Correction: None
[Module Characteristics]
Row Address Bits: 16
Column Address Bits: 10
Module Density: 8192 Mb
Number Of Ranks: 1
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.83300 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.60000 ns
CAS# Latencies Supported: 9, 11, 13, 15, 16
Minimum CAS# Latency Time (tAAmin): 13.320 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.320 ns
Minimum Row Precharge Time (tRPmin): 13.320 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns
Supported Module Timing at 1200.0 MHz: 16-16-16-39
Supported Module Timing at 1066.7 MHz: 15-15-15-35
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 800.0 MHz: 11-11-11-26
Supported Module Timing at 666.7 MHz: 9-9-9-22
Minimum Active to Active/Refresh Time (tRCmin): 45.375 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 260.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 160.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.299 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): <= 1 mm
Address Mapping from Edge Connector to DRAM: Standard
[Intel Extreme Memory Profile (XMP)]
XMP Revision: 2.0
[Certified Profile [Enabled]]
Module VDD Voltage Level: 1.35 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.62500 ns
CAS# Latencies Supported: 14
Minimum CAS# Latency Time (tAAmin): 8.750 ns
Minimum RAS# to CAS# Delay (tRCDmin): 8.750 ns
Minimum Row Precharge Time (tRPmin): 8.750 ns
Minimum Active to Precharge Time (tRASmin): 21.250 ns
Supported Module Timing at 1600.0 MHz: 14-14-14-34
Minimum Active to Active/Refresh Time (tRCmin): 30.000 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 260.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 160.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 24.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.500 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 5.000 ns

Dodatečně přidáno po 3 minutách 36 vteřinách:
kdyztak reknete co je treba jeste doposlat cely log se sem nevešel

Log muzes dat treba na leteckoupostu nebo jiny server komplet.

Ten torture test je dobre nechat bezet aspon 24h - videl jsem masiny, ktere prosly vsechny testy, ale
nechat pres noc rendering videa neslo, vzdycky to spadlo.

"K topiku pls a asi koupis a pak jdes po mesici na vyslech kriminalky (mluvim z vlastni zkusenosti) nikdy vic"

Pokud nebudes nakupovat od zjevnych podvodniku, ale treba od nemeckych firem co prodavaji sw 20 let,
maji stovky tisic prodeju, tak se ti to zcela urcite nestane. Zadny normalni obchodnik se sw nebude riskovat
prusvih kvuli par Euro - a ze se po tom v Nemecku jde (stahnes film a 800 Ecek pokuta).

Tech licenci jsme tam nakoupili desitky, nikdy zadny problem, prochazi to sw audity. Dovolim si poukazat na to,
ze za ty 3200 Kc za Windows z CZC/Alzy bys mel celou lepsi zakladni desku s 370 chipsetem.

Pokud jde o desku, ja nikdy nemontuju mATX desky, ale ATX, kde je rozmisteni komponent podstatne lepsi
z hlediska zahrivani - jsou dal od sebe a tedy lepe chlazene.

taky by to chtělo poslední bios ... Verze 5220 ... ten stávající vypadá víc než rok starý ...